HF650P-0.001-01-00-104 Bergquist Self-Adhesive Hi-Flow 650P Thermal Gap Pad, 1.5W/m·K
Part Nnumber
HF650P-0.001-01-00-104
Description
Self-Adhesive Hi-Flow 650P Thermal Gap Pad, 1.5W/m·K
The product with part number HF650P-0.001-01-00-104 (Self-Adhesive Hi-Flow 650P Thermal Gap Pad, 1.5W/m·K)
is from company Bergquist and distributed with basic unit price 2,09 EUR. Minimal order quantity is 1 pc.
MaterialHi-Flow 650P Material Trade NameHi-Flow 650P Maximum Operating Temperature+150°C Minimum Operating Temperature-40°C Self-AdhesiveYes Thermal Conductivity1.5W/m·K Thickness0.001in Product Details Hi-Flow 650P Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules. Thermal Impedance: 0.20°C-in2/W (@25 psi)150°C high temperature reliabilityNatural tack one side for ease of assemblyExceptional thermal performance in an insulated pad Thermally Conductive Insulators (Heatsinks)
Following Parts
Random Products
(keyword HF650P-0.001-01-00-104 Bergquist Self-Adhesive Hi-Flow 650P Thermal Gap Pad, 1.5W/m·K)
